Circuposit™ 3000-1 from Dupont Dow Rhom Hass Company

2022-03-07 10:11

Circuposit™ 3000-1 Electroless Copper is a unique, patented process that is widely used by leading PCB fabricators throughout the world. This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space and improving quality and control. The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.

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垂直连续电镀（VCP）高TP值酸性镀铜光泽剂用电镀中间体：www.tongtai-technology.com/news/170.html

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2021年度填孔镀铜——印刷线路板（PCB，FPC）酸性填孔镀铜中间体：www.tongtai-technology.com/news/283.html

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深圳市同泰化学技术有限公司参加了2021年7月26-28日在广州保利世贸博览馆举办的第十四届广州国际表面处理、电镀、涂装展览会，诚邀您莅临同泰化学电子展厅参观指导！电子展厅链接：www.tongtai-technology.com/news/316.html。

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