Copper Gleam™ HV-101 & HV-606 Electrolytic Copper
2022-03-07 09:44
Copper Gleam™ HV-101 and HV-606 electrolytic coppers are the latest offerings for panel plating in Vertical-in-Line equipment. They deliver high plating efficiency to improve productivity and reduce cost.
The Copper Gleam™ HV-606 bath has been developed to work with insoluble anodes to deliver high plating performance at high current densities.
Key Benefits:
- Excellent throwing power on through-holes and microvias
- Exceptional panel plating distribution
- Exceptional leveling performance on panel surface and inside through holes
- Round plated shape on via bottom
- Good thermal reliability
Excellent Throwing Power
Exceptional levelling
Ideal Microvia
Bottom Shape
酸性镀铜中间体相关链接：
垂直连续电镀（VCP）高TP值酸性镀铜光泽剂用电镀中间体：www.tongtai-technology.com/news/170.html
PCB/FPC用高TP值VCP酸性镀铜光亮剂中间体产品介绍：www.tongtai-technology.com/news/30.html
2021年度填孔镀铜——印刷线路板（PCB，FPC）酸性填孔镀铜中间体：www.tongtai-technology.com/news/283.html
2021年国际表面处理展电子展厅：
深圳市同泰化学技术有限公司参加了2021年7月26-28日在广州保利世贸博览馆举办的第十四届广州国际表面处理、电镀、涂装展览会，诚邀您莅临同泰化学电子展厅参观指导！电子展厅链接：www.tongtai-technology.com/news/316.html。
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