Microfill™ LVF 3 Acid Copper from Dupont Dow Rhom Hass Company
2022-03-07 10:06
Microfill™ LVF 3 Acid Copper is designed to offer exceptional blind microvia filling performance, and is specifically formulated for use with insoluble anodes and direct current (DC) rectification. Formulated to operate over a broad range of operating conditions, the bath offers end users with outstanding production flexibility in either panel or pattern plate operation.
Advantages:
- Excellent blind microvia fill with lower copper surface thickness
- Bright, highly ductile, leveled deposit
- DC process with insoluble anodes for simple operation
- Easily analyzed and controlled by conventional CVS
- Designed for use in both pattern and panel plate applications
- Tunable process for specific end user requirements
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Read Technology for Through Hole Filling
Microfill™ THF Electrolytic Copper
Dielectric thickness: 110 µm
Plating thickness: 12 µm
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