Metallization for Flexible Circuits
2022-03-07 09:53
Enabling high-density flexible boards
DuPont’s longstanding expertise in electroless copper plating is an excellent match for the demands of flexible and rigid-flex circuits built with polyimide. As more applications migrate to flexible boards, DuPont is committed to providing solutions that will enable high performance in any design configuration. Our highly conductive copper metallization is compatible with roll-to-roll processing and low-stress for long-term durability.
Choose DuPont as your materials solutions partner to provide:
- Cost-effective copper plating
- Balanced pH that is suitable for chemically-sensitive polyimide substrates
- Multiple plating options tailored to your specific application
- Meeting Flexible PCB Demands
Metallization Materials for PCBs
- Flexible Circuits
- Multi-Layered Boards
- High Density Interconnect
- IC Substrates
Flexible Circuits
Copper plating to meet the demands of flexible PCBs.
A patented 3-step desmear to effectively clean, condition and activate hole-wall surfaces.
A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications
Processes especially designed for operation in vertical and horizontal equipment respectively
Producing uniform crystal grain structure to provide a smooth plated surface on rolled copper
A copper plating process producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.
Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance
酸性镀铜中间体相关链接：
垂直连续电镀（VCP）高TP值酸性镀铜光泽剂用电镀中间体：www.tongtai-technology.com/news/170.html
PCB/FPC用高TP值VCP酸性镀铜光亮剂中间体产品介绍：www.tongtai-technology.com/news/30.html
2021年度填孔镀铜——印刷线路板（PCB，FPC）酸性填孔镀铜中间体：www.tongtai-technology.com/news/283.html
2021年国际表面处理展电子展厅：
深圳市同泰化学技术有限公司参加了2021年7月26-28日在广州保利世贸博览馆举办的第十四届广州国际表面处理、电镀、涂装展览会，诚邀您莅临同泰化学电子展厅参观指导！电子展厅链接：www.tongtai-technology.com/news/316.html。
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